Heat sink(lsi) - List of Manufacturers, Suppliers, Companies and Products

Heat sink Product List

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[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

Support from thermal design to provide the right products! Free provision of analysis using simulation software and actual measurement data for thermal countermeasures!

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We aim to shorten development time and propose suitable costs. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also available, so please feel free to contact us.

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Crimp-type heat sink / comb fit

Crimp-type heat sink / comb fit

Heat sink compatible with high-output LEDs! Customization available according to application and structure.

As specialists in thermal radiation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural cooling heat fins as well as forced air cooling solutions. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Sink for Driver Circuits P Series" - Heat sinks with mounting terminals for TO-220 packages. - A wide range of standard lineups is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We offer heat fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fishing lights. *Online meetings are also possible, so please feel free to contact us.

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and heat absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are utilized as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. [Contents] - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin type heat sink - H Series: Multipurpose, general-purpose fin type heat sink *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out.

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Flexible heat sink

Flexible heat sink

The heat sink fits the curved surface! The fin shape and size can be customized according to your requirements.

We offer a "Flexible Heat Sink" that elegantly addresses the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that have been difficult to install on until now, maximizing heat dissipation effectiveness. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.

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  • Heat exchanger
  • Parts and Materials

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Heat radiator Comb fit

Heat radiator Comb fit

The principle of comb-fit connection is...

The surface of the aluminum material that makes up the base and fins of the heat sink is covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal will bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extrusion type with a slit fin type.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface mount devices are of the aluminum extrusion type and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices with aluminum extrusion.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink designed for forced air cooling.

We are pursuing high performance in heat sinks and radiators. Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Heat sink

Heat sink

Quickly transfers heat.

This is a radiator for electronic components that prevents the destruction of devices by quickly transferring and cooling heat. It mainly consists of a base plate to which the heat-generating element is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

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Heat sink for pin-mounted devices P/FP/U series

Heat sink for pin-mounted devices P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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Foot-operated non-contact disinfectant pump stand "Alshu III"

Foot-operated non-contact disinfectant pump stand "Alshu III"

For hand disinfection at the office reception or factory entrance! You can push the pump bottle without touching it, making it hygienic! It is compatible with commercially available bottles as well!

The "Alshu III" is an alcohol disinfectant stand equipped with a foot pedal. By stepping on the pedal, disinfectant can be dispensed from the pump, allowing for disinfection without directly touching the push area, thereby reducing the risk of infection through contact with the push area by multiple people. Since it is foot-operated, no power supply is needed, making it easy to use in various locations such as office reception areas, factory entrances, meeting room entrances, and employee cafeteria entrances. 【Features】 - Allows hand disinfection without touching the pump - Compatible with commercially available bottles - No assembly required - Made in Japan (high quality) - Available in sizes for children, etc. *We can accommodate short delivery times for bulk purchases, so please consult us. *For purchases, please contact us directly through the link below.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Since it is shaped using aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! It is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Comb Fit Heat Sink YK/YU/YX・YC Series

Comb Fit Heat Sink YK/YU/YX・YC Series

Achieving high-performance heat sinks with our unique aluminum pressure welding technology!

The comb-fit heat sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It features excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and intermediate fins → The number of intermediate fins can be changed to freely set the width of the fins (width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb-fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together under pressure, the metals bond, improving thermal conductivity between the base and fins → The stress generated during press-fitting and work hardening are combined to join the fins and base → The bonding strength is incomparable to simply pushing the fins into the base *Online meetings are also possible, so please feel free to contact us.

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